As a Graduate Physical Design Engineer, you will participate in the development of advanced semiconductor products and be involved in the complete physical implementation flow. Your responsibilities include: Support SoC and subsystem physical design implementation from netlist to GDSII. Participate in floorplanning, power planning, placement, clock tree synthesis (CTS), routing, and chip finishing activities. Perform timing, power, signal integrity, and physical verification analysis. Debug design implementation issues and drive convergence toward project PPAC (Performance, Power, Area, Cost) targets. Work with cross-functional teams including RTL Design, DFT, Verification, IP, Package, and Technology teams. Develop and improve EDA automation scripts using Python, Tcl, or other scripting languages. Explore AI-assisted design methodologies to improve engineering productivity and design quality. Support silicon bring-up, design reviews, and tapeout activities. Contribute to continuous improvement of backend methodologies, flows, and best practices. Qualifications： Master's degree (graduating in 2027) in: Microelectronics Integrated Circuit Design Electronic Engineering Computer Engineering Automation Related disciplines Basic knowledge of VLSI design flow and semiconductor fundamentals. Familiarity with Linux/Unix environments. Programming experience in Python, Tcl, Perl, Shell, or C/C++. Strong analytical and problem-solving skills. Good communication and teamwork skills. Fluent written and spoken English. Preferred Coursework or project experience in: ASIC/SoC Design Physical Design Timing Analysis DFT Digital IC Design Hands-on experience with EDA tools such as: Synopsys Fusion Compiler ICC2 PrimeTime Cadence Innovus Tempus Calibre Experience with machine learning or AI applications in semiconductor design. Publications, competitions, or research projects related to EDA or IC design are a plus. More information about NXP in Greater China... #LI-6650

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